The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1999
Filed:
Dec. 11, 1996
Tetsuro Washida, Tokyo, JP;
Katsunori Ochi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor integrated circuit device includes a semiconductor integrated circuit chip, a IC package enclosing the semiconductor integrated circuit chip, lead terminals, and dummy terminals. The lead terminals are partly embedded in the IC package side by side along its opposed sides, and the dummy terminals are partly embedded in the IC package at both ends of a line of the lead terminals. These terminals are electrically connected with the circuit formed in the chip. One end of each terminal protrudes from either of the opposed sides of the IC package and has a connection to be connected with terminal electrodes of a packaging substrate. The dummy terminals are made wider and/or longer than the lead terminals so as to make their connections larger than those of the lead terminals, thereby enhancing their reliability in point of machine-resistance and heat-resistance.