The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 1999

Filed:

Aug. 15, 1996
Applicant:
Inventors:

Vincent Rigal, Sceaux, FR;

Eric Daniel, Issy-les-Moullineaux, FR;

Assignee:

Schlumberger Industries, Montrouge, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257679 ; 257668 ; 257678 ; 257692 ; 257730 ;
Abstract

An electronic micropackage for an electronic memory card, particularly applicable to large-sized semiconductor chips. The micropackage includes a semiconductor chip disposed on a first face of an insulating support, and electrical contact zones extending along a plane defined by a second face of the insulating support. The semiconductor chip is connected to the electrical contact zones via connection wires. A metal strip is provided with cut-outs defining the electrical contact zones. A strip of insulating material is disposed on one face of the metal strip, the strip of insulating material constituting said insulating support, and leaving uncovered, at least in part, the electrical contact zones. A housing for the semiconductor chip, surrounding the insulating support and obstructing those cut-outs in the metal strip which are inside the housing and which are not obstructed by the insulating support. A coating of resin covers the semiconductor chip and the connection wires, at least partially filling the housing.


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