The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 1999

Filed:

Jul. 22, 1996
Applicant:
Inventors:

Matthew F O'Keefe, Chelmsford, MA (US);

Joel L Goodrich, Westford, MA (US);

Donald Cordeiro, Woburn, MA (US);

Nitin Jain, Nashua, NH (US);

Assignee:

The Whitaker Corporation, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438 39 ; 438602 ;
Abstract

It has been identified that a known loss mechanism in the access path to a mesa type device is more significant than previously believed. The source of the loss is due to the electromagnetic interaction of the wire bond and the device side wall which induces an image current at the side wall along the path of the wire bond. According to the teachings of the present invention, a process for forming a conductive coating on a semiconductor device is disclosed. The coating reduces high frequency losses associated with the device. The processes disclosed are compatible with existing semiconductor fabrication devices and advantageously provide improved uniformity and repeatability.


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O'Keefe, Matthew. (1999). Process for reducing bond resistance in semiconductor devices and (U.S. Patent No. 5877037). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5877037

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