The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1999
Filed:
Nov. 12, 1996
Taihei Nakada, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
In a first step, a conductive layer a1 is formed on a three-dimensionally curved upper surface of a main mold. In a second step, a peripheral surface mold is attached to the outer peripheral surface of the main mold, and a liquid dielectric of an age hardening type is cast onto the conductor layer, and hardened. In a third step, the peripheral surface mold is detached from the main mold, and an unnecessary portion of the hardened dielectric is cut to thereby form a dielectric layer. In a fourth step, another conductor layer is formed on the dielectric layer. A method comprising these steps enables a dielectric board with a voluntary three-dimensionally curved surface to be manufactured with high accuracy.