The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1999
Filed:
Jul. 31, 1997
Hisaya Fukunaga, Kanagawa, JP;
Komatsu Electronic Metals Co., Ltd., Kanagawa, JP;
Abstract
The present invention proposes a method for cutting semiconductor ingots into sliced wafers by use of wire saws, so that the cut-out surface shape of wafers can be easily controlled by utilizing a wire-saw cutting device. The workpiece holding plate 21 is disposed in such a way that it can move along the longitudinal axis Y of the semiconductor ingot 3. The semiconductor ingot 3 is moved downward to facilitate the cutting operation by wire saw. Accordingly, the displacement along the longitudinal axis Y is made to change in response to the variation along the location of the semiconductor ingot 3.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile