The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1999
Filed:
Mar. 26, 1998
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.