The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1999
Filed:
Aug. 14, 1995
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.