The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1999
Filed:
Apr. 10, 1997
Applicant:
Inventors:
Hirofumi Hajime, Miyazaki, JP;
Toshiharu Yubitani, Miyazaki-gun, JP;
Assignee:
Komatsu Electronic Metals Co., Ltd., Hiratsuka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451 63 ; 451262 ; 451267 ; 451269 ;
Abstract
A method for polishing a semiconductor wafer is provided. A semiconductor wafer is detached from a polishing pad on a side of an upper polishing plate and is kept to be supported by a lower polishing plate. A contact area between the a wafer and the upper polishing plate is set to be less than a contact area between the wafer and the lower polishing plate. As a result, the wafer is definitely detached from the polishing pad on the side of the upper polishing plate and is to be kept supported by the lower polishing plate when the upper polishing plate is lifted.