The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 1999

Filed:

Jun. 17, 1997
Applicant:
Inventor:

Herbert M Shapiro, Liguna Niguel, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228 33 ; 228254 ; 21912165 ;
Abstract

The placement of solder 'balls' in a Ball Grid Array is accomplished by placing a solder strip in contact with the top surface of the ball grid array carrier. The pulsing of a laser directed at the solder in discrete positions permits the transfer of the solder to the gold dot, of the array of dots, on the carrier in registry with the laser output when activated. Selective solder placement is possible and increasingly higher throughput is achieved by the use of laser diode bars or optical fiber fans to effect solder transfer to a plurality of dots of the array simultaneously. The entire process can be automated by making the solder strip continuous through a recycling station arranged along a path along which the solder strip moves to the position where the carrier and the solder strip are moved into juxtaposition. The use of a transparent strip with a pattern of holes filled with solder paste permits easy transfer of the solder to the gold dots or islands on the carrier in registry with laser beam.


Find Patent Forward Citations

Loading…