Low impedance contoured laminated bus assembly and method for making same

Abstract

A curved low impedance laminated bus assembly includes a curved first sheet of relatively thin conductive material forming an AC bus conductor and a curved second sheet of relatively thin conductive material forming a -DC bus conductor directly connected to a -DC line side of a DC energy storage device. A curved third sheet of relatively thin conductive material forms a +DC bus conductor directly connected to a +DC line side of the DC energy storage device and is connected to the AC bus conductor through a +DC switch. A plurality of dielectric sheets are laminated between the AC bus conductor, the -DC bus conductor, and the +DC bus conductor. A method of making the low impedance laminated bus assembly includes providing a first substantially planar sheet of relatively thin conductive material forming an AC bus conductor, providing a second substantially planar sheet of relatively thin conductive material forming a -DC bus conductor, providing a third substantially planar sheet of relatively thin conductive material forming a +DC bus conductor, providing plurality of dielectric sheets, stacking said plurality of dielectric sheets between said AC bus conductor, said -DC bus conductor, and said +DC bus conductor to form a laminated bus structure having alternating conductive and non-conductive layers. Lastly, the laminated bus structure is bent from a first substantially planar shape to a second curved shape.