The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 1999
Filed:
Dec. 20, 1995
Yoshikatsu Yamamoto, Nagano, JP;
Takaichi Wada, Nagano, JP;
Nagamitsu Takashima, Nagano, JP;
Motonori Okumura, Nagano, JP;
Kazuhiko Hara, Nagano, JP;
Yuji Tanaka, Nagano, JP;
Takahiro Katakura, Nagano, JP;
Kohji Watanabe, Nagano, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
An ink supply port forming substrate 21, a common ink chamber forming substrate 25, and a nozzle plate 27 are bonded together, by inserting between them thermally fusible films 31and 32 respectively, in which are formed through holes 45 and 45 at two or more positions, and by also filling the film through holes with an adhesive that is mixed with a gap material G for adjusting the thicknesses of the thermally fusible films when they are fused, so as to form a flow path unit 30; and then the flow path unit 30 and the actuator units 1 are bonded together by inserting between them a thermally fusible film 33, in which are through holes 64 at two or more positions, and by also filling the through holes with an adhesive that is mixed with a gap material G for adjusting the thickness of the thermally fusible film when it is fused. In this structure, the extruded quantity of the thermally fusible films can be received by the through holes 45 and 64, and the gap materials G can prevent the thermally fusible films from being unnecessarily spread out.