The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 1999
Filed:
Mar. 14, 1997
Anton Nenadic, Red Hook, NY (US);
David Scott Graboski, Wappingers Falls, NY (US);
William A Cavaliere, Verbank, NY (US);
James Edward Tersigni, Castleton, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A cutting assembly and an apparatus for self-aligned chamfering of a workpiece are disclosed. The chamfering apparatus includes a mechanism for releasably securing the workpiece in preparation for a chamfering thereof, a cutting assembly, and a mechanism for moving the cutting assembly proximate the securing mechanism between a first position and a second position, wherein the cutting assembly traverses along an edge portion of the workpiece to be chamfered. The cutting assembly includes (i) a guide member having a guide surface; (ii) a blade member mechanically coupled with respect to the guide surface for establishing a desired cutting depth; (iii) a mechanism for applying a resilient tensioning force to the guide member, the resilient tensioning means applying a first tensioning force when the guide member is in a non-chamfer engaging position and applying a second tensioning force when the guide member is in a chamfer engaging position, the chamfer engaging position corresponding to a position of the guide member when the guide surface engages the portion of the workpiece to be chamfered; and (iv) a mechanism for locking the guide member to maintain the chamfer engaging position and the desired cutting depth subsequent to the guide surface no longer being in contact with the workpiece. A method of chamfering is also disclosed.