The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 1999

Filed:

Sep. 29, 1995
Applicant:
Inventor:

Michitaka Urushima, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257684 ; 257737 ; 257778 ;
Abstract

A transparent base film of a semiconductor device package has a device hole into which a semiconductor chip is inserted. Formed on the base film are a plurality of pads arranged as a matrix from wirings for connecting the plurality of pads to the electrodes of the semiconductor chip. A transparent cover resist is applied to the entire surface of the base film except for the top portions of the plurality of pads, and spherical bumps are formed respectively on the plurality of pads. With this arrangement, it is possible to make inspection of bonding conditions between the bumps and the outer lead bonding pads on a printed circuit board even after the package is mounted on the printed circuit board.


Find Patent Forward Citations

Urushima, Michitaka. (1999). Semiconductor package fabricated by using automated bonding tape (U.S. Patent No. 5869887). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5869887

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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