The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1999
Filed:
Oct. 15, 1997
Shinji Kadoriku, Takarazuka, JP;
Yoshio Maruyama, Kyoto, JP;
Takaaki Higashida, Kadoma, JP;
Hiroshi Yutani, Katano, JP;
Keizo Matsumura, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The separation of a lower mold from an upper mold in an injection molding machine is either temporarily paused or carried out at a lower speed so as to maintain deformation of a thin component within a permissible range, while a jet of air is applied to help remove the thin component from the upper mold. Also, the ejecting operation of the thin component is either temporarily paused or carried out at a lower speed before the deformation of the thin component exceeds the permissible limit while a jet of air is applied to help remove the thin component from the lower mold.