The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 1999
Filed:
Dec. 05, 1997
Applicant:
Inventors:
Ming Chun Chen, Milpitas, CA (US);
Paul J Steffan, Elk Grove, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438 14 ; 438 15 ;
Abstract
A method of manufacturing semiconductor wafers using a simulation tool to determine predicted wafer electrical test measurements. The simulation tool combines in-line critical dimensions from previous from previous processes run on the current wafer lot, data from previous lots for processes subsequent to the process being run on the current lot and calibration simulation data obtained from the comparison of the predicted wafer electrical test measurements and collected wafer electrical test measurements taken from previous actual wafer electrical test measurements.