The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 1999
Filed:
Oct. 22, 1996
Vaughn R Marian, Jr, Saratoga, CA (US);
Donald R Mullen, Fremont, CA (US);
Acuson Corporation, Mountain View, CA (US);
Abstract
An ultrasound adapter assembly includes a rectangular zero-insertion-force receptacle, such as the ITT Cannon.RTM. DL-series Zero Insertion Force ('DL-ZIF') receptacle, and a high-density micro-coaxial ('HDMC') connector plug interconnected by micro-coaxial conductors. The adapter assembly includes a frame for supporting the two connectors and a locking mechanism for use in semi-permanently attaching the adapter assembly to an ultrasound imaging system receptacle. The adapter assembly permits old-style ultrasound transducer assemblies having the rectangular zero-insertion-force plug to be used with newer ultrasound imaging systems using the newer HDMC interfacing system. In an alternative embodiment, the two connectors are electrically interconnected using flex-circuit. The HDMC connector plug is formed using a multi-layer printed wiring board having a high density array of electrical contact pads on one surface arranged for compatible mating with the newer system HDMC interfacing receptacle. Solder pads are placed on the opposed surface for solder attachment of the micro-coaxial cables and the alternative flex-circuit. A second multi-layer printed wiring board includes pre-tinned feedthroughs for solder connection to the Cannon DL-ZIF connector. An opposed surface of the second printed wiring board includes solder pads for attachment of the micro-coaxial cables and the alternative flex-circuit. In another alternative embodiment, the flex-circuit is attached at both ends to separate connectors forming an interconnection assembly, and both the second printed wiring board and the HDMC plug printed wiring board include mating connectors for attachment of the interconnecting flex-circuit assembly.