The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 1999
Filed:
Jul. 09, 1997
Masahiro Fuchigami, Norton, MA (US);
Salvatore P Rizzo, Attleboro, MA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
Socket apparatus (10) particularly adapted for use of burn-in tests of IC components having a large number of contact points on the bottom surface thereof has a cover frame (16) and adapter plate (22) movably mounted on a base (16). A latch assembly (30) is pivotably mounted on the base (12) at each side thereof and is linked to the cover frame so that when the cover frame is moved downwardly toward the base against the bias of spring members (20) each latch member (30a) is pivoted away from the seating surface allowing an IC component to be inserted into the socket or removed from the socket. When the cover frame (16) is allowed to return to its normal, at-rest position, each latch member pivots toward the base member to a position overlying the seating surface and engages an IC component received on the seating surface and transfers a force through the IC component to the adapter plate thereby lowering the adapter plate and exposing contact elements (14) so that they engage respective contact points of the IC component. In a modified embodiment (10') heat sink assemblies (40) are mounted for movement with two opposing latch assemblies (30). Each heat sink assembly comprises a head (42) movable between inner and outer positions so that the head can be brought into engagement with an IC component with a selected level of spring force for optimum thermal coupling.