The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 1999
Filed:
Dec. 06, 1996
Toru Nishikawa, Yokohama, JP;
Ryohei Satoh, Yokohama, JP;
Masahide Hara, Yokohama, JP;
Tetsuya Hayashida, Tokyo, JP;
Mitugu Shirai, Hatano, JP;
Osamu Yamada, Hiratsuka, JP;
Hiroko Takehara, Yokohama, JP;
Yasuhiro Iwata, Yokohama, JP;
Mitsunori Tamura, Hatano, JP;
Masahito Ijuin, Fujisawa, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.