The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 1999

Filed:

Jun. 25, 1996
Applicant:
Inventor:

Kazuhide Koyama, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257767 ; 257773 ; 257775 ; 257765 ;
Abstract

In a wiring system provided by the present invention, a first conductive wire is provided on a surface on one side of an dielectric layer of a semiconductor device, a second conductive wire made of an Al like metal is provided on a surface on the other side of the dielectric layer, a connection hole is drilled through the dielectric layer, the first and second conductive wires are connected to each other through the connection hole, and a compensation pattern made of the Al like metal is created in the second conductive wire, so that generation of voids in the Al like metal of the second conductive wire due to an electro-migration phenomenon is prevented, enhancing the reliability of the wire.


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