The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 1999

Filed:

Jan. 24, 1997
Applicant:
Inventors:

Katsuo Ito, Shizuoka-ken, JP;

Kiyoshi Sasaki, Shizuoka-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
264 405 ; 2643281 ; 425150 ; 425595 ; 4254519 ;
Abstract

A method and system of controlling a screw engaging position adjuster provided in a complex mold clamping system. A theoretical deviation of a screw engaging position is theoretically calculated on the basis of a distance by which a movable die has been moved from an origin set for a mold thickness adjustment in clamping process. A measured deviation of the screw engaging position is measured from a distance between a mold clamping cylinder and a movable platen in clamping process. The screw engaging position adjuster is so controlled that a difference between the theoretical deviation and the measuring deviation is within an allowable deviation having previously been set.


Find Patent Forward Citations

Ito, Katsuo. (1999). Method and apparatus for adjustment in mold thickness of a complex mold (U.S. Patent No. 5863474). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5863474

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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