The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 1999
Filed:
May. 21, 1996
Applicant:
Inventor:
Hidehiko Akasaki, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257-737 ; 257700 ; 257738 ; 257780 ; 438613 ;
Abstract
An integrated circuits package or a chip carrier having an integrated circuits chip sealed therein comprises layers of ceramic substrates, and terminal steps which are connected to inner pads in contact with the integrated circuits chip and which are provided on the bottom surface of at least one layer of the package, preferably the lowermost layer. The terminal steps are provided in a lattice arrangement, with so many rows of terminal steps as equals the number of terminal steps in one row, thus enabling connection of all of the terminals of the chip to outside wirings, such as wirings of a mother board.