The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1999
Filed:
Aug. 29, 1997
Applicant:
Inventors:
Masatoshi Ishii, Takefu, JP;
Hiroyuki Miyamoto, Takefu, JP;
Yukihiro Kuribayashi, Takefu, JP;
Masanobu Uchida, Takefu, JP;
Hajime Kitamura, Ibaraki-ken, JP;
Genji Noguki, Ibaraki-ken, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., , JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M / ; H01M / ;
U.S. Cl.
CPC ...
429 59 ; 296231 ; 420900 ;
Abstract
A method of producing a hydrogen absorbing alloy powder, which comprises a step of treating a pulverized hydrogen absorbing alloy with a solution comprising a conjugated unsaturated compound having at least 5 conjugated .pi. bonds and a molecular weight of at least 100 and, prior to the this step, optionally comprises a step of treating a pulverized hydrogen absorbing alloy with a mineral acid or alkali; and an electrode using a hydrogen absorbing alloy powder produced by the aforesaid method.