The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 1999

Filed:

Feb. 06, 1997
Applicant:
Inventors:

Mingliang Lawrence Tsai, Holmdel, NJ (US);

Ferdinand A DeAntonis, Flemington, NJ (US);

Alfieri Degrassi, Pottsville, PA (US);

Assignee:

AlliedSignal Inc., Morris Twp., NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B29C / ;
U.S. Cl.
CPC ...
4284744 ; 4284758 ; 4284761 ; 4284763 ; 4284769 ; 428412 ; 428516 ; 428483 ; 15624411 ; 156325 ; 156326 ; 156327 ;
Abstract

Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.


Find Patent Forward Citations

Tsai, Mingliang. (1999). High temperature release films (U.S. Patent No. 5858550). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5858550

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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