The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 1999

Filed:

Aug. 22, 1997
Applicant:
Inventors:

Theo L Geussens, Meeuwen-Gruitrode, BE;

Herbert Bongartz, Einsiedeln, CH;

Jozef J Van Dun, Lake Jackson, TX (US);

Assignees:

Dow Belgium, Tessenderlo, BE;

Dow Europe S.A., Horgen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ; B29D / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
428 369 ; 428 3692 ; 525240 ;
Abstract

Hollow molded articles prepared from a molding composition comprising: (A) from 95 to 60 percent by weight, based on the weight of (A) and (B), of an ethylene polymer having a density of 0.955 g/cm.sup.3 or higher, a melt index from 0.3 to 10 g/10 min, a melt index ratio I.sub.21 /I.sub.2 of from 40 to 80, and a polydispersity of from 1.8 to 10, the ethylene polymer being selected from the group consisting of i) high density ethylene homopolymers and ii) high density ethylene copolymers prepared by slurry or gas phase polymerization in the presence of a Ziegler or Phillips catalyst or prepared by polymerization in the presence of a transition metal compound catalyst containing a cyclopentadienyl or cyclopentadienyl derivative moiety; and (B) from 5 to 40 percent by weight, based on the weight of (A) and (B), of a homogeneous linear or substantially linear ethylene interpolymer having a density from 0.85 to 0.93 g/cm.sup.3, a melt index from 0.5 to 5 g/10 min, and a polydispersity of from 1.8 to 2.5 , the ethylene interpolymer being an interpolymer of at least ethylene and an .alpha.-olefin; wherein the composition has a density from 0.94 to 0.962 g/cm.sup.3 ; and a process of manufacturing hollow molded articles by molding such composition are claimed.


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