The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 1999

Filed:

Jul. 29, 1996
Applicant:
Inventor:

John O'Boyle, Redwood City, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361761 ; 361764 ;
Abstract

A micro-electronic assembly, a substrate for use in the assembly and an associated method are disclosed herein. The substrate includes an outer surface configuration defining an aperture within a first surface and electrically conductive leads on the first surface. In the overall micro-electronic assembly, a micro-device includes an active surface supporting at least one component which projects outwardly from the surface. The micro-device further includes electrically conductive bumps on the active surface. The micro-device is positioned on the first surface of the substrate such that the projecting component extends at least partially into the aperture defined by the substrate and so that the electrically conductive leads of the micro-device are electrically engaged with the electrically conductive leads of the substrate.


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