The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 1999
Filed:
Nov. 20, 1995
Yuichi Yoshida, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The invention provides an outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, the apparatus including (a) a bonding-aid member having a central portion and a marginal portion, the semiconductor chip being to be adhered to a lower surface of the central portion of the bonding-aid member, the bonding-aid member being to be adhered at the marginal portion thereof to the substrate, the bonding-aid member being formed with an opening for exposing distal ends of the leads at which the leads are to be bonded to the bonding pads, (b) a device for ascertaining whether the leads align with the bonding pads, and (c) a bonding tool having compressing portions for compressing the leads to the bonding pads, the compressing portions having a cross-section to be able to pass through the opening of the bonding-aid member. The invention makes it possible to avoid misalignment of the leads of a semiconductor chip to the bonding pads by simpler arrangement than prior apparatuses.