The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 1999

Filed:

Jul. 12, 1996
Applicant:
Inventors:

Kirk A Martin, Aptos, CA (US);

Richard A Kanishak, Danville, CA (US);

Assignee:

Nisene Technology Group, Santa Cruz, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
156345 ;
Abstract

An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a source of etchant solution and an etching assembly including an etch plate and a bell jar or cover, the etch plate and bell jar forming an etching chamber. Optionally, an etch cup or fixture is supported by the etch head or the electronic device package is mountable in the chamber directly on the etch head. A source of pressurized gas such as nitrogen provides a positive pressure about 2 PSI to the bell jar and to flow the etchant solution through the etch head and onto an exterior surface of the electronic device package so that the encapsulant is etched and when break out occurs on a side wall of the package, the pressure in the bell jar is vented to a waste reservoir and the pressure at the etchant solution source is reduced so that etchant solution flow is instantly stopped to prevent any damage to the electronic device by excessive etching.


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