The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1998
Filed:
Sep. 20, 1996
Tomishige Yatsugi, Hitachinaka, JP;
Masayuki Kimura, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a combined, small-sized, portable video/still camera system, it is intended to improve the reliability against a rise in internal temperature of the system and improved reliability against vibration, while keeping small the external size of the system. Such compact system includes a PCMCIA hard disk drive capable of being loaded to, and removed from, the image recording/reproducing system. According to the present invention, as set forth hereinabove, a plate or medium formed of a thermally conductive rubber or copper (higher in thermal conductivity than air) is mounted on an encoder LSI package attached to a side of a circuit board opposite to the hard disk mounted side, and such medium is arranged to conduct heat to the system housing formed of aluminum or other material high in thermal conductivity. As a result, the housing is efficiently used as a heat sink. The hard disk is disposed centrally in the interior of the system, and thus an impact or vibration exerted on the exterior of the system is transmitted to the hard disk only through the mounting frame, so that the impact or vibration is relatively diminished. As an additional advantageous arrangement, the LSI package surface and the system housing are drawn very close to each other, for example not larger than 2 mm in terms of the spacing between the two, such that the heat of the LSI package can be transferred to the system housing at a high efficiency.