The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 1998

Filed:

Jan. 02, 1997
Applicant:
Inventors:

Takemori Takayama, Osaka, JP;

Yoshitaka Ohyama, Osaka, JP;

Kazuo Okamura, Osaka, JP;

Masato Miyake, Ishikawa, JP;

Katsuyoshi Saito, Kyoto, JP;

Hiroshi Ono, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08K / ;
U.S. Cl.
CPC ...
528338 ; 528310 ; 528322 ; 5283291 ; 528339 ; 528340 ; 528341 ; 524100 ; 524227 ; 524600 ; 524606 ; 419 32 ; 419 36 ; 419 37 ; 419 38 ; 419 41 ; 419 44 ; 419 53 ; 419 57 ; 264 63 ; 264344 ; 264645 ; 264656 ; 264657 ; 264670 ;
Abstract

A low-cost thermal decomposition degreasing method capable of drastically reducing the time required for a degreasing process which involves heating, vaporization and thermal decomposition, while assuring the shape retention property of an injection molded product during degreasing. The degreasing process comprises: (i) a first step wherein a molded product placed under a reduced pressure less than or equal to atmospheric pressure is heated at a temperature lower than the melting point of a thermoplastic binder so that the thermoplastic binder partially evaporates by 5 wt % or more, and then the molded product is further heated at a temperature lower than higher one of the melting points of a more volatile organic compound and a thermoplastic resin whereby the thermoplastic binder further evaporates by 10 wt % or more, and wherein the final temperature is set to 200.degree. C. or less; and (ii) a second step wherein the molded product is heated to a temperature higher than or equal to the highest one of the melting points of thermoplastic binder components at a pressure higher than or equal to atmospheric pressure in an atmosphere of gas inert relative to a powder material constituting the molded product.


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