The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1998
Filed:
Aug. 11, 1997
Michael Derek Tisack, Ann Arbor, MI (US);
Kenneth Andrew Winowiecki, Waterford, MI (US);
Ford Global Technologies, Inc., Dearborn, MI (US);
Abstract
A method of manufacturing a panel having a foam interlayer. A flexible cover is placed adjacent a first mold in an open tool. A rigid substrate is placed adjacent a second mold, or alternately, is place atop the flexible cover in the first mold, of the opened tool. The first and/or second molds are electrically isolated from one another and from the associated manufacturing equipment. A vacuum draws the cover against the first mold and retains the cover in position during the manufacturing operation. The tool is moved to a closed position and the cover is positioned juxtaposed the substrate. The cover and substrate are positioned a distance apart thus creating a space therebetween. A vacuum is created in the space and a radio frequency (RF) electric field is applied between the first and second molds. The RF electric field causes a plasma to be created within the space. The plasma activates both the cover and the substrate. While the space is still under vacuum, a foaming material is injected into the space. The foaming material is drawn into the space by the vacuum and adheres to the activated cover and substrate. The RF electric field is subsequently coupled in the space to dielectrically cure the foam material.