The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 1998

Filed:

Jul. 09, 1997
Applicant:
Inventors:

Masahiro Tamaki, Tokyo, JP;

Katsuya Kosaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25B / ; B05B / ;
U.S. Cl.
CPC ...
205157 ; 204277 ; 118620 ;
Abstract

An electroplating apparatus includes an electroplating tank having a generally flat base on which a semiconductor substrate may be placed with a surface to be electroplated oriented upwardly. A first seal seals a tank body to the flat base and a second seal seals the tank body to a peripheral portion of the surface of the semiconductor substrate. A substantially sealed volume adjacent the surface of the semiconductor substrate is produced. A gas supply tube for pressurizing the volume and an electrolyte discharge arrangement for discharging electrolyte from the volume when pressurized by a gas introduced through the gas supply tube are also provided. The discharge tube extends through a wall of the tank body to a position immediately above the surface of the semiconductor substrate within the volume.


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