The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1998
Filed:
Apr. 08, 1996
Peter H Vo, Tucson, AZ (US);
John F Binnie, Jr, Tucson, AZ (US);
Raytheon Company, Los Angeles, CA (US);
Abstract
A missile having an improved dome mounting arrangement, and a method for mounting a sapphire dome to a titanium missile turret that provides for minimum surface deformation and environmental sealing of the dome. A sealing material such as silicone rubber compound that is capable of enduring high temperatures attained during high speed missile flight is employed. The missile has a body with a nose and the dome mounting arrangement is attached to the nose. The dome mounting arrangement comprises a turret secured to the nose, the dome, and a retainer ring attached to the turret for securing the dome to the turret. An annular gap is formed between an outer surface of the dome and an inner surface of the retainer ring. The silicone rubber compound is disposed in the annular gap and cured to seal the dome. A plurality of shims may be disposed between the dome and the turret in a radial gap formed therebetween. A plurality of shims may also be disposed between the dome and the retaining ring around the periphery of the dome during assembly, so that the dome rotates freely after shimming. This ensures that the dome is stress-free during and after curing of the silicone rubber compound. The shims are removed after the silicone rubber compound no longer flows. The silicone rubber compound is cured for high temperature performance by curing for four hours, minimum, at room temperature, and then curing for two hours, minimum, at 160.degree..+-.10.degree. F., and then curing at 260.degree..+-.10.degree. F. for 30 minutes, minimum, and then curing them at 360.degree..+-.10.degree. F. for 30 minutes, minimum. Finally, the compound is cured at 400.degree..+-.10.degree. F. for 30 minutes, minimum, and then cooled to room temperature.