The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1998
Filed:
Aug. 15, 1996
Motomi Ichihashi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor sensor comprising a substrate having thick-film conductors formed on both sides of the substrate, a semiconductor sensor chip having a diaphragm to which a pressure to be detected is applied and a pan-shaped cap bonded to the mounting side of the substrate with a die bond agent, further comprises plural through-holes pierced through the substrate, conductors formed in plural through-holes which connect the thick-film conductors to each other, bonding electrodes formed from a thick-film conductor on the mounting side of the substrate, each being connected to the thick-film conductor of the mounting side of the substrate and to the semiconductor sensor chip by a wire bonding, and a protection glass film formed on the thick-film conductor of the mounting side having apertures for forming exposed conductor portions of the thick-film conductor, wherein the opening of each through-hole and the exposed conductor portions are disposed at the position to which the cap is bonded and covered by the die bond agent for bonding the cap.