The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1998
Filed:
Nov. 24, 1997
William E Bessey, Charlotte, NC (US);
Gerald Peter Rumierz, Tega Cay, SC (US);
Clinton Dale Felton, Charlotte, NC (US);
Hoechst Celanese Corp., Warren, NJ (US);
Abstract
A rigid three-dimensionally shaped fiber network structure having improved post-yield dimensional recovery is composed of a deformed textile fabric network structure containing: (A) at least one oriented, semi-crystalline monofilament yarn containing a thermoplastic polymer and disposed in the deformed fabric so as to provide a plurality of monofilament cross-over points therein; and (B) a cured crosslinkable resin impregnating the deformed network structure so as to effect bonding of all or substantially all of the monofilament cross-over points. The network structure is made by subjecting the monofilament yarn to a fabric-forming process to form a deformable fabric, subjecting the deformable fabric to an area-enlarging deformation process to form the initial three-dimensionally shaped network structure composed of a deformed textile fabric, demolding the initial network structure and then curing the crosslinkable resin, which has been added before the deformation process, before demolding and/or after demolding. Curing of the crosslinkable resin bonds all or substantially all of the monofilament cross-over points, thereby converting the initial network structure into a rigid final network structure having improved post-yield dimensional recovery.