The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1998
Filed:
Sep. 26, 1996
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
In manufacturing an optical semiconductor device, light-emitting elements are mounted on their respective printed boards of an insulating plate with a silver paste interposed therebetween. A sealing mold having a shape (a lens forming portion) necessary for forming a projected lens is adhered to the major surface of the insulating plate in accordance with each of the light-emitting elements of each of the printed boards. A liquid epoxy resin having a melt viscosity of 100 Pa.multidot.s to 200 Pa.multidot.s is continuously injected into the sealing mold with the lens forming portion of the sealing mold downward. The liquid epoxy resin is then hardened to form a projected, domed lens on each of the light-emitting elements. After that, the sealing mold is removed, and the insulating plate is separated for each of the light-emitting elements into surface-mounted optical semiconductor devices each having a projected, domed lens. Consequently, a lens having a large diameter can be formed in a short time, thereby increasing in luminance and improving in yield and quality, without increasing in manufacturing costs.