The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1998
Filed:
Sep. 17, 1996
Thomas R Cundiff, Puyallup, WA (US);
Bradley A Frye, Auburn, WA (US);
The Boeing Company, Seattle, WA (US);
Abstract
A process for making a layered product having a honeycomb core having empty cells, the process comprising the steps of: (a) placing a first layer of an uncured adhesive film on the top side of a central honeycomb core having empty cells, and placing a second layer of an uncured adhesive film on the bottom side of the central honeycomb core; (b) placing a first layer of an uncured prepreg material above the first layer of uncured adhesive film, and placing a second layer of an uncured prepreg material below the second layer of uncured adhesive film; (c) placing a first layer of a dry fiber preform above the first layer of uncured prepreg material, and placing a second layer of a dry fiber preform below the second layer of uncured prepreg material; (d) placing the charge made by steps (a)-(c) inside a mold and closing the mold; (e) heating the mold to the cure temperature of the adhesive film and the prepreg material, and holding the mold at this temperature for sufficient time to cure the adhesive film and the prepreg material; (f) reducing the temperature of the mold to the injection temperature of a selected resin transfer molding (RTM) resin system, and injecting the selected resin transfer molding (RTM) resin system into the mold; (g) holding the temperature of the mold at the cure temperature for the resin transfer molding (RTM) resin system for sufficient time to cure the resin system; and, (h) removing the product from the mold after curing is completed.