The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1998
Filed:
Aug. 01, 1997
Eric M Rieder, Alton, CA;
Frank Gonzalez, Brampton, CA;
Randal C Schulhauser, Brulington, CA;
Bryan Zart, Shakopee, MN (US);
Medtronic Inc., Minneapolis, MN (US);
Abstract
An implantable medical device of the type formed of a hermetically sealed enclosure attached on a enclosure attachment surface thereof to a module attachment surface of a pre-formed header module is disclosed. The pre-formed header module is attached to the enclosure attachment surface through use of a retention structure extending away from the enclosure surface into proximity with a portion of the pre-formed header module when the enclosure and module attachment surfaces are aligned with respect to one another. The retention structure comprises a bendable member that is bent from an initial position allowing the pre-formed header module to be seated with respect to the hermetically sealed enclosure to a retention position making an attachment against a bend engaging portion of the pre-formed header module. The bendable member is the free end portion of an attachment tab having a tab base attached at a predetermined location of the hermetically sealed enclosure such that the upstanding attachment tab extends in a predetermined direction away from the enclosure surface and the free end of the attachment tab is bendable laterally with respect to the predetermined direction against the bend engaging portion. Adhesive is then applied to the retention mechanism and the space between the enclosure attachment surface and the module attachment surface.