The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1998
Filed:
Mar. 11, 1997
Applicant:
Inventors:
Hiroji Tani, Nagaokakyo, JP;
Naoaki Ogata, Moriyama, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
75246 ; 75245 ; 75228 ; 75331 ; 75255 ; 75247 ; 75342 ; 148513 ; 148514 ;
Abstract
A method of producing copper powder having little variation in its particle size and an excellent monodispersion properties. A copper complex ion solution is prepared from a copper-containing solution and a complexing agent, then a reducing agent is added to the copper complex ion solution to precipitate metallic copper. The copper-containing solution herein contains copper sulfate, copper formate, copper pyrophosphate, copper chloride or copper carbonate and the complexing agent is at least one carboxylate or phosphate.