The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1998
Filed:
Nov. 16, 1993
Dean Laurin, Round Lake Beach, IL (US);
Angeles Lillian Buan, Crystal Lake, IL (US);
Lecon Woo, Libertyville, IL (US);
Michael T Ling, Vernon Hills, IL (US);
Yuan Pang Ding, Vernon Hills, IL (US);
William Anderson, Hoffman Estates, IL (US);
Larry A Rosenbaum, Gurnee, IL (US);
Denise S Hayward, Mundelein, IL (US);
Joseph P Hoppesch, McHenry, IL (US);
Gregg Nebgen, Burlington, WI (US);
Stanley Westphal, East Dundee, IL (US);
Baxter International Inc., Deerfield, IL (US);
Abstract
Multiple component polymer compositions for fabrication into articles. In particular, polymeric compositions comprising a heat resistant polymer; a radio frequency ('RF') susceptible polymer; a compatibilizing polymer; the composition having physical properties within the range a<40,000 psi; b>=70%; c<30%; d>1.0; e<0.1%; f<0.1%; g>=0.05; h<=60%; i=0; wherein: a is the mechanical modulus of the composition measured according to ASTM D-882; b is the percent recovery in length of the composition after an initial 20% deformation; c is the optical haze of the composition being 9 mils in thickness according to ASTM D-1003; d is the loss tangent of the composition at 1 Hz measured at melt processing temperatures; e is the elemental halogen content by weight of the composition; f is the low molecular weight water soluble fraction of the composition; g is the dielectric loss between 1 and 60 MHz and over temperatures of 25.degree. to 250.degree. C. of the composition; h sample creep measured at 121.degree. C. for a 1 inch strip of the composition under 27 psi loading; and, i indicates the composition exhibits no strain whitening after being strained at moderate speeds of about 20 inches (50 cm) per minute to about 100% elongation (twice the original length) and the presence of strain whitening (indicated by 1) or lack thereof (indicated by 0) is noted.