The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 1998
Filed:
Nov. 07, 1995
Kamran Manteghi, Manteca, CA (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
A ball grid array (BGA) package configuration for packaging an integrated-circuit die includes a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad. The bonding fingers are disposed peripherally surrounding the die-attach pad. An integrated-circuit die is mounted on the die-attach pad. Bonding fingers are interconnected between the bonding pads on the integrated-circuit die and the plurality of bonding fingers. A plastic material is molded over the top of the lead frame and the die while still providing an exposed bottom surface of the bonding fingers on the lead frame. A solder mask is disposed over the bottom of the lead frame so as to form selective solder areas. Solder balls are attached to the selective solder areas.