The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 1998
Filed:
Aug. 23, 1996
Applicant:
Inventor:
Ronald A Carpio, Austin, TX (US);
Assignee:
Sematech, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ; H01L / ;
U.S. Cl.
CPC ...
205775 ; 1563 / ; 1563 / ; 1566271 ; 1566361 ; 1566371 ; 1566451 ; 204400 ; 204412 ; 204434 ; 2057895 ; 2057905 ; 2057945 ; 216 86 ; 216 89 ; 216 90 ;
Abstract
Chemical mechanical polishing slurry characteristics, such as oxidant concentration and abrasive particle dispersion, are determined using electrochemical measurement techniques, such as chronoamperometry, amperometry, chronopotentiometry, ionic conductivity, or linear sweep potentiometry. Slurry characteristics may be tested and monitored independent of a CMP polishing tool. Slurry characteristics may also be automatically controlled in an on-line chemical mechanical polishing process using electrochemical measurements.