The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 1998

Filed:

Aug. 07, 1996
Applicant:
Inventors:

Ren-Kae Shiue, Taipei, TW;

Richard Andrews, Westborough, MA (US);

Thomas W Eagar, Belmont, MA (US);

Bradley Miller, Westboro, MA (US);

Sergej-Tomislav Buljan, Acton, MA (US);

Assignee:

Norton Company, Worcester, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D / ;
U.S. Cl.
CPC ...
51295 ; 51309 ;
Abstract

A bond material for a metal single layer abrasive tool, and especially for a tool with diamond abrasive, provides an excellent combination of mechanical properties including structural strength and impact resistance. The bond material is sufficiently compatible with both metal and diamond to effectively wet the abrasive grains and the core of the tool during brazing. The bond material can braze at a temperature range low enough that the core will not distort and diamond grains will not graphitize during brazing. The novel bond material composition contains a copper/tin bronze alloy; elemental titanium; zirconium; hard granular wear resistant particles; and elemental carbon. The wear resistant particles are preferably titanium carbide. Importantly, the bond produced from the material has superior wear resistance while remaining very adhesive to diamond.


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