The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 1998

Filed:

Mar. 25, 1997
Applicant:
Inventors:

Stephen J Ferrigno, Cincinnati, OH (US);

William D Cowie, Xenia, OH (US);

Seetharamaiah Mannava, Cincinnati, OH (US);

Assignee:

General Electric Company, Cincinnati, OH (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F01D / ;
U.S. Cl.
CPC ...
4162 / ; 21912885 ;
Abstract

A crack weld repair and method, particularly, for a gas turbine engine blade or other metallic component in the engine, providing a metallic substrate, a metallic filler bonded onto a substrate bond surface on the metallic substrate, and a region having deep compressive residual stresses imparted by laser shock peening extending into the substrate beneath the substrate bond surface. One embodiment provides a laser shock peened surface below the weld material filled void in a damaged area of the component forming a region of deep compressive residual stresses imparted by laser shock peening (LSP) extending from the laser shock peened surface into the component. Optionally, the surface over the repaired area of the weld filled void may also be laser shock peened forming a second region of deep compressive residual stresses imparted by laser shock peening (LSP) extending from the laser shock peened surface into the weld repair. Another embodiment provides a weld buildup tip overlay on a substrate bond surface of an airfoil tip having a laser shock peened region beneath the substrate bond surface.


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