The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 1998

Filed:

Aug. 28, 1996
Applicant:
Inventors:

Wei Chen, Midland, MI (US);

Hongxi Zhang, Midland, MI (US);

Kevin Edward Lupton, Midland, MI (US);

David Joseph Romenesko, Midland, MI (US);

Randall Gene Schmidt, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524264 ; 524265 ; 524267 ; 525100 ; 525104 ; 525106 ; 525398 ; 525431 ; 525446 ; 525479 ;
Abstract

A method of dispersing silicone compositions in organic thermoplastic materials is disclosed. The novel compositions produced by the method of the invention have a fine and relatively uniform dispersion or organosilicone in an organic thermoplastic. An organosilicone resin (A) and a predominantly linear silicone fluid (B) are first blended to substantial homogeneity to form an organosilicone alloy therefrom. The organosilicone alloy exhibits thermoplastic behavior and has a temperature-dependent complex viscosity .eta.*.sub.Si (T) associated therewith. Likewise the organic thermoplastic materials have a temperature-dependent complex viscosity, .eta.*.sub.OTP (T), associated therewith. The organic thermoplastic and the organosilicone alloy are thereafter mixed at a predetermined mixing temperature, T.sub.m, and a predetermined shear strain rate. The organic thermoplastic material and the organosilicone alloy are both in a flowable state at T.sub.m. The value of T.sub.m is selected to be about .+-.30.degree. C. of a temperature, T.sub.0, wherein the absolute value of {72*.sub.OTP (T.sub.0)-.eta.*.sub.Si (T.sub.0)} is at its lowest value, at the predetermined shear strain rate.


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