The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1998
Filed:
Oct. 11, 1995
Applicant:
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Kyongki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; B23K / ;
U.S. Cl.
CPC ...
420562 ; 148 22 ; 148 23 ;
Abstract
A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.
Yoo, Choong. (1998). Lead-free soldering material having superior solderability (U.S. Patent No. 5843371). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5843371
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile