The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1998
Filed:
Apr. 11, 1997
Keihin Corporation, Tokyo, JP;
Abstract
In a method for applying a powder state mold lubricant onto a die-casting mold, a movable mother die and a stationary mother die are clamped to define a mold cavity with a movable insert die and a stationary insert die, in which a plunger tip slidably arranged within a sleeve opens a molten material supply hole, and communication between the sleeve and the mold cavity is blocked. A pressure within the mold cavity is reduced by opening a powder suction passage opening into the mold cavity and establishing communication between a powder discharge passage communicated with a powder storage source and a molten material supply passage opening to the mold cavity. The powder state mold lubricant is directly within the powder storage source into the mold cavity via the molten material supply passage for applying the powder state mold lubricant on the mold surface of the mold cavity. With such constriction, the powder state mold lubricant will not pass through the chamber or passage having large volume but pass through passages having small volume, the powder state mold lubricant will never fall down to be accumulated within the passage.