The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 1998

Filed:

Jul. 31, 1997
Applicant:
Inventor:

Sueji Shibata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H01R / ;
U.S. Cl.
CPC ...
361820 ; 361820 ; 361679 ; 361683 ; 439 66 ; 439 73 ; 439 68 ; 439 69 ; 439 74 ; 439 67 ; 439 72 ; 439 71 ; 439 70 ;
Abstract

An IC socket comprises a socket body including a plurality of contacts for interconnecting an IC and a wiring board. Each of the contacts comprises a contacting arm including an upper end contact portion for a lead of an IC to overlie and contact, and a lower end contact portion including a downwardly facing projection capable of abutting with a wiring portion of the wiring board, and a pressing element projecting backwardly of the contacting arm from an area in the vicinity of a connecting portion between the projection and the contacting arm. The projection forming the lower end contact portion is received in an upwardly and downwardly open through-hole formed in the socket body, so as to be subjected to abutment with the wiring portion. A resilient body held by the socket body is interposed between the pressing element and the contacting arm to retain a standby posture of the contact, and the contact is turned forwardly about the projection received in the through-hole to thereby cause the pressing element to compress the resilient body, so that a contacting pressure between the upper end contact portion of the contacting arm and the IC lead is obtained by a restoring force of the resilient body.


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