The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1998
Filed:
Nov. 24, 1995
Applicant:
Inventor:
Yasuhiro Murasawa, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257668 ; 257676 ; 257692 ; 257735 ; 257741 ; 257773 ;
Abstract
A tape carrier structure (T1,T2) for a tape carrier package on which at least one semiconductor chip (1) is mounted, the tape carrier structure (T1,T2) having a polyimide tape (3) and leads (2) joined onto the polyimide tape (3), an end of each of the leads (2) being connected to one of connecting pads corresponding thereto, the connecting pads being provided on the semiconductor chip (1), wherein the polyimide tape (3) has a facing portion (3a) which is situated so as to face to the semiconductor chip (1) except the connecting pads on condition that the semiconductor chip (1) is mounted on the tape carrier package.