The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1998
Filed:
Oct. 28, 1996
Applicant:
Inventors:
Jack Howard Linn, Melbourne, FL (US);
Gregg Douglas Croft, Palm Bay, FL (US);
Assignee:
Harris Corporation, Melbourne, FL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257532 ; 257534 ; 257618 ; 257620 ;
Abstract
A bonded wafer structure has a device wafer 18 bonded to a handle wafer 10. A capacitor including a bottom plate as the surface 11 of handle wafer 10, a dielectric layer 12 and a top plate 15 is embedded in the bonded structure. A contact trench 22 extends from the surface 8 of device wafer 18 to the top plate 15 of the embedded capacitor.
Linn, Jack. (1998). Capacitor structure in a bonded wafer and method of fabrication (U.S. Patent No. 5841182). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5841182
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile