The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 1998

Filed:

May. 14, 1997
Applicant:
Inventors:

Shuji Takiguchi, Shizuoka, JP;

Keizo Nishitani, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
174 / ;
Abstract

A wire harness device for instrument panels in which when a wire harness for an instrument panel and electrical element units are mounted to the instrument panel, a complicated construction for junction units of the harness like the conventional movable connector is unnecessary; little shift exist in position against the element units; and it is easily fixed to improve its maintainability. A wire harness device comprises a plurality of mounting spouts formed on an instrument panel and having electrical element unit inserted from a front surface side of the mounting spout for mounting on the instrument panel; a plurality of junction units on the instrument panel with connecting portion of the electrical element unit connected to the junction unit; and a wire harness for the instrument panel comprising a plurality of junction units and resilient circuit bodies.


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